论文信息 - Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps - 字舞流文

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

C. Selvanayagam | Xiaowu Zhang | J. Lau | S. Seah | K. Vaidyanathan | T. Chai | J. H. Lau | S.K.W. Seah