Flexible Substrates of Multi Metal Layer

PURPOSE: A multi-layered substrate is provided to have a compact size and also to simplify fabrication and installation by fabricating a multi-layered substrate of flexible type via a reel or a roll. CONSTITUTION: A chip mounting groove(40) for receiving chip components(30) to be mounted is provided within the upper center of a base sheet(20) of a BGA(Ball Grid Array)(10). A lead(50) is introduced to a main edge of the chip component(30) to be connected with a conductor layer(60) deposited on the surface of the base sheet(10). In a conductor layer of a main edge of the chip mounting groove(40), a solder ball(70) is connected downwardly to be mounted onto a printed circuit board via heating. A First and a second conductor layers(60a;60b) are applied with insulating adherence(80;80') in the upper and the lower parts so that third and forth conductor layers(90a;90b) can be stacked in sequence. The third and the fourth conductor layers(90a;90b) are interconnected by a via hole(100).