A Comprehensive Investigation of a Common-Mode Filter for Gigahertz Differential Signals Using Quarter-Wavelength Resonators

This paper presents a comprehensive investigation on an inexpensive and wideband common-mode noise suppression filter that uses a quarter-wavelength resonator. An equivalent transmission line model is also used to evaluate the effectiveness of the proposed structure in a common-mode filter (CMF). Moreover, more important parameters, such as coupling coefficients are presented to investigate the characteristics of CMF unit. The performance of CMF is then characterized using two coupling coefficients between two differential traces and between differential traces and a quarter-wavelength resonator. A simple design approach is also presented for a wideband CMF. Numerical results demonstrate that CMF with three different lengths of quarter-wavelength resonators have rejection bands of 3.94-8.74 GHz and 3.53-10.1 GHz at cutoff frequencies of -20 dB and -10 dB, respectively Time-domain common-mode noise is decreased by approximately 60%. Moreover, analyses of differential insertion loss and group delay indicate that the differential signals maintain sufficient signal integrity when the wideband CMF is used in single- and two-pair differential interconnects. Finally, CMF is validated by an eye diagram and by measurements of time/frequency-domain common-mode noise and I/O cable common-mode current.

[1]  K. Gupta,et al.  Microstrip Lines and Slotlines , 1979 .

[2]  D. Pozar Microwave Engineering , 1990 .

[3]  Jia-Sheng Hong,et al.  Microstrip filters for RF/microwave applications , 2001 .

[4]  Eric Bogatin Signal Integrity - Simplified , 2003 .

[5]  Lin-Kun Wu,et al.  Design of miniaturized common-mode filter by multi-layer low temperature co-fired ceramic , 2003 .

[6]  L. L. Wai,et al.  Mixed-mode S-parameter characterization of differential structures , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[7]  Stephen C. Thierauf,et al.  High-Speed Circuit Board Signal Integrity , 2004 .

[8]  Lin-Kun Wu,et al.  Design of miniaturized common-mode filter by multilayer low-temperature co-fired ceramic , 2004, IEEE Transactions on Electromagnetic Compatibility.

[9]  Wei-Da Guo,et al.  A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers , 2006, IEEE Transactions on Microwave Theory and Techniques.

[10]  Ruey-Beei Wu,et al.  Comparisons between serpentine and flat spiral delay lines on transient reflection/transmission waveforms and eye diagrams , 2006, IEEE Transactions on Microwave Theory and Techniques.

[11]  Christos Christopoulos,et al.  Introduction to Electromagnetic Compatibility , 2007 .

[12]  T. Itoh,et al.  A Novel Wideband Common-Mode Suppression Filter for Gigahertz Differential Signals Using Coupled Patterned Ground Structure , 2009, IEEE Transactions on Microwave Theory and Techniques.

[13]  Zhang-Cheng Hao,et al.  Ultra-Wideband Bandpass Filter With Multiple Notch Bands Using Nonuniform Periodical Slotted Ground Structure , 2009, IEEE Transactions on Microwave Theory and Techniques.

[14]  Che-Ming Hsu,et al.  New wideband common-mode noise filter using quarter-wavelength resonator for high-speed differential signals , 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

[15]  Jun Fan,et al.  Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions , 2010, IEEE Transactions on Electromagnetic Compatibility.

[16]  Tzong-Lin Wu,et al.  A Broadband and Miniaturized Common-Mode Filter for Gigahertz Differential Signals Based on Negative-Permittivity Metamaterials , 2010, IEEE Transactions on Microwave Theory and Techniques.

[17]  F de Paulis,et al.  Design of a Common Mode Filter by Using Planar Electromagnetic Bandgap Structures , 2010, IEEE Transactions on Advanced Packaging.

[18]  B. Archambeault,et al.  Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures , 2012, IEEE Transactions on Electromagnetic Compatibility.