Leakage mechanisms in the trench transistor DRAM cell

The authors discuss a band-to-band tunneling mechanism in the trench transistor cell (TTC), which is used in Texas Instruments' 4-Mbit DRAM. This effect should be operative in the class of trench cells in which the charge is stored inside the trench and the substrate forms a capacitor plate. This effect does not compromise the functionality of the cell; in fact, it has the potential of improving the long-term reliability of the cell by preventing electrical overstress of the trench capacitor oxide. >

[1]  K. V. Rao,et al.  Trench capacitor design issues in VLSI DRAM cells , 1986, 1986 International Electron Devices Meeting.

[2]  H. E. Davis,et al.  A 4-Mbit DRAM with trench-transistor cell , 1986 .

[3]  H. Shichijo,et al.  Trench transistor DRAM cell , 1986, IEEE Electron Device Letters.

[4]  H. E. Davis,et al.  Characterization of Trench Transistors for 3-D Memories , 1986, 1986 Symposium on VLSI Technology. Digest of Technical Papers.

[5]  K. F. Hulme,et al.  Dependence of peak current density on acceptor concentration in germanium tunnel diodes , 1962 .

[6]  L. Esaki New Phenomenon in Narrow Germanium p-n Junctions , 1958 .

[7]  D. Critchlow,et al.  The SPT cell—A new substrate-plate trench cell for DRAMs , 1985, 1985 International Electron Devices Meeting.

[8]  Y. Hokari,et al.  Buried storage electrode (BSE) cell for megabit DRAMs , 1985, 1985 International Electron Devices Meeting.

[9]  P. Chatterjee,et al.  A trench transistor cross-point DRAM cell , 1985, 1985 International Electron Devices Meeting.