Microstructure evolution and mechanical properties of ultrasonically soldered 7075 Al alloy joint with metal foam/Sn composite solder
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Jian Zhang | Yong Xiao | Ling Wang | Dan Li | Chao Wan | Huaqiang Fu | Zhipeng Song | Shanglai Li
暂无分享,去创建一个
Jian Zhang | Yong Xiao | Ling Wang | Dan Li | Chao Wan | Huaqiang Fu | Zhipeng Song | Shanglai Li