Radiated emission analysis of power bus noise by using a power current model of an LSI
暂无分享,去创建一个
Yoshitaka Toyota | Yukihiro Fukumoto | Zhi Liang Wang | O. Wada | O. Shibata | T. Kinoshita | R. Koga | K. Takayama
[1] Hirokazu Tohya,et al. SPICE simulation of power supply current from LSI on PCB with a behavioral model , 1999, 1999 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.99EX147).
[2] I. Novak. Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination , 1999 .
[3] James L. Drewniak,et al. Power bus decoupling on multilayer printed circuit boards , 1995 .
[4] Yoshitaka Toyota,et al. Power Current Model of LSI/IC Containing Equivalent Internal Impedance for EMI Analysis of Digital Circuits , 2001 .
[5] Barry Kent Gilbert,et al. High-frequency characterization of power/ground-plane structures , 1999 .
[6] Jun Fan,et al. Modeling multilayered PCB power-bus designs using an MPIE based circuit extraction technique , 1998, 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253).
[7] Keunmyung Lee,et al. Modeling and analysis of multichip module power supply planes , 1995 .
[8] I. Novak,et al. Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination , 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).
[9] Satoshi Nakamura,et al. A design method of decoupling circuits for a digital PCB to reduce high frequency current on power and ground planes , 1999, 1999 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.99EX147).
[10] F. Olyslager,et al. Study of the ground bounce caused by power plane resonances , 1998 .
[11] H. H. Wu,et al. Accurate power supply and ground plane pair models [for MCMs] , 1999 .
[12] Yoshitaka Toyota,et al. Power current model of LSI and parameter identification for EMI simulation of digital PCBs , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).