论文信息 - Dry Etch Challenges in Gate All Around Devices for sub 32 nm Applications - 字舞流文

Dry Etch Challenges in Gate All Around Devices for sub 32 nm Applications

J. Hartmann | S. Barnola | N. Vulliet | T. Ernst | C. Dupré | C. Vizioz | P. Gautier | C. Arvet | S. Bécu | V. Maffini-Alvaro | T. Chevolleau | B. Guillaumot | C. Comboroure | S. Borel | É. Bernard | S. Pauliac-Vaujeour