A novel Cleaning in Place (CIP) approach and CFD modeling of the re- moval of thin films from metal surfaces with rotating high speed jets

while the substrate traverses under the nozzle carrier. The interaction between the jets and the film layer is a complex phenomenon. The moving substrate poses further complexity. This work addresses the numerical modeling of the film removal process by using Computational Fluid Dynamics (CFD). The Volume Of Fluid (VOF) method, which is an interface tracking ap proach by acknowledging the presence of water, air and viscous layer, is used for multiphase modeling. Ro tary impingement is achieved by implementing an inlet condition which transforms the jet by a time dependent rotational tensor. The rough substrate is geometrically modeled and the viscous layer is resolved by employing a fine grid. Arbitrarily Mesh Interface (AMI) between the substrate and the jet regions enables the movement of the substrate with a certain velocity in perpendicular direction of impingement. The model en ables parametric analysis to study the effect of standoff distance, viscosity of the film layer, substrate rough ness, substrate speed, frequency of rotation of the nozzle carrier and thus to optimize the cleaning downtime. An open-source code OpenFOAM® is used for CFD modeling and simulation.