Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging

During isothermal aging, the interfacial microstructure evolution of Au–12Ge/Ni joints as well as its influence on the shear strength and the fracture behavior have been investigated. Results showed that there was a duplex layer of NiGe and Ni5Ge3 intermetallic compounds (IMCs) in the joints after soldering. The most obvious changes in morphology were the transformation from scallop type to planar type microstructure. EPMA data indicated that the growth of the total IMC layer was mainly attributed to the growth of Ni5Ge3 phase. Furthermore, it was found that the grain boundary diffusion was the dominant growth-controlling mechanism of overall IMC layer and the activation energy was 82.23 kJ/mol. In addition, the shear strength decreased continuously with extended aging time. The fracture of as-produced joint was at solder/IMCs interface, showing both ductile and brittle morphology. After the subsequent aging process, a thicker IMC layer was formed at the interface, leading to the movement of the fracture to IMCs region, a transformation of fracture to brittle morphology and a deterioration in shear strength.

[1]  T. S. Abhilash,et al.  Nickel dissolution into AuGe in alloyed AuGe/Ni/Au Ohmic contacts on GaAs/AlGaAs multilayer structures , 2010 .

[2]  C. Leinenbach,et al.  Thermodynamic study and re-assessment of the Ge-Ni system , 2012 .

[3]  Y. J. Chen,et al.  Origin and evolution of voids in electroless Ni during soldering reaction , 2012 .

[4]  C. Leinenbach,et al.  Experimental investigation and thermodynamic modeling of the Au–Ge–Ni system , 2012, Monatshefte für Chemie - Chemical Monthly.

[5]  Yao Yao,et al.  Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process , 2016 .

[6]  J. Botsis,et al.  Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder , 2013 .

[7]  W. T. Chen,et al.  Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films , 2002 .

[8]  Wei Zhou,et al.  Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys , 2014 .

[9]  C. Leinenbach,et al.  Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys , 2014, Journal of Materials Engineering and Performance.

[10]  Hiroshi Sato,et al.  Solid-State Interfacial Reaction between Eutectic Au-Ge Solder and Cu/Ni(P)/Au Metalized Ceramic Substrate and Its Suppression , 2015 .

[11]  Zhong Chen,et al.  Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization , 2004 .

[12]  Shan Chen,et al.  Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al , 2007 .

[13]  Guido Schmitz,et al.  Mechanical properties of Pb-free SnAg solder joints , 2011 .

[14]  V. Chidambaram,et al.  Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics , 2012, Journal of Electronic Materials.

[15]  C. Leinenbach,et al.  Low temperature TLP bonding of Al2O3–ceramics using eutectic Au–(Ge, Si) alloys , 2013, Journal of Materials Science.

[16]  Qiang Yu,et al.  Interfacial reaction mechanism and kinetics between Au–20Sn and Sn , 2016, Journal of Materials Science: Materials in Electronics.

[17]  King-Ning Tu,et al.  Growth kinetics of planar binary diffusion couples: ’’Thin‐film case’’ versus ’’bulk cases’’ , 1982 .

[18]  C. Leinenbach,et al.  Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates , 2011 .

[19]  Hao-Hsiang Chuang,et al.  Elimination of voids in reactions between Ni and Sn: A novel effect of silver , 2012 .

[20]  Jenq-Gong Duh,et al.  Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint , 2013 .

[21]  Y. Chan,et al.  Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement , 2016 .

[22]  S. Lin,et al.  Formation of alternating interfacial layers in Au-12Ge/Ni joints , 2014, Scientific Reports.

[23]  J. Hattel,et al.  Development of Au–Ge based candidate alloys as an alternative to high-lead content solders , 2010 .

[24]  C. Leinenbach,et al.  Characterization of the isothermal solidification process in the Ni/Au–Ge layer system , 2015, Journal of Materials Science.

[25]  K. Aasmundtveit,et al.  Au–sn SLID bonding: Fluxless bonding with high temperature stability to above 350 °c , 2009, 2009 European Microelectronics and Packaging Conference.

[26]  Qiang Yu,et al.  Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints , 2015, Journal of Materials Science: Materials in Electronics.