High-Reliability Bonding by Nano-Silver Paste with Tin Addition for High Temperature Electronic

A high-reliability bonding used by nano-silver (nano-Ag) paste with tin (Sn) was proposed in the paper. The transient liquid phase (TLP) bonding was combined with the Ag NPs sintering technology to shorten the sintering time and improve the high-temperature reliability of the bond line. After bonding, the Ag-Sn joint could form a full Ag3Sn structure. After aging, almost no pores and cracks could be observed at the interface of the Ag-Sn joint, and the Sn diffused to the Cu substrates to form Cu-Sn intermetallic compounds (IMCs), which prevents the Cu substrate from being oxidized and delaminated. The original shear strength of Ag-Sn joint is 23.7 MPa, which is 19.7% higher than the nano-Ag one. Meanwhile, the shear strengths of Ag-Sn joints are always higher than that of the nano-Ag joints at different aging time. The results indicate that the Ag-Sn joint possesses high reliability and the nano-Ag paste with Sn has great research significance as a die-attach material for high power device packaging.

[1]  Mingxiang Chen,et al.  Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding , 2022, Materials Today Communications.

[2]  K. S. Siow,et al.  Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints , 2021 .

[3]  H. Nishikawa,et al.  Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

[4]  Jun Ho Hwang,et al.  Transient Liquid Phase Bonding Process Using Sn-coated Cu Dendritic Particles , 2020, Metals and Materials International.

[5]  K. Suganuma,et al.  Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules , 2019, Ceramics International.

[6]  H. Nishikawa,et al.  Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium , 2018, Journal of Alloys and Compounds.

[7]  Mingyu Li,et al.  A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet , 2018, Journal of Materials Science: Materials in Electronics.

[8]  Chunqing Wang,et al.  Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions , 2017 .

[9]  Kuan Yew Cheong,et al.  Die Attach Materials for High Temperature Applications: A Review , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[10]  Kojiro F. Kobayashi,et al.  Metal-metal bonding process using Ag metallo-organic nanoparticles , 2005 .