Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module

Abstract Effective cooling is very important issue in a light emitting diode (LED) module because its performance and reliability decrease significantly as the junction temperature increases. This study proposes a cooling method that improves upon the poor ventilation and heat dissipation of a horizontal fin heat sink mounted on an LED module with natural convection. Response surface methodology (RSM) was used to optimize the geometry of the horizontal fin heat sink with the modified openings, and the cooling performance of the proposed model was compared against those of conventional fin heat sinks. The total thermal resistance of the proposed model is decreased by 30.5% relative to that of the conventional no-opening model at an orientation of 180° and a heat input of 10 W. In addition, the luminous efficacy of the proposed model is increased by 23.7% relative to that of the conventional no-opening model at an orientation of 180° and a heat input of 25 W.

[1]  Pankaj Singh,et al.  Experimental investigation of heat transfer enhancement through embossed fin heat sink under natural convection , 2015 .

[2]  Tzu-Chen Hung,et al.  Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection , 2008 .

[3]  Zongtao Li,et al.  Reconstruction and thermal performance analysis of die-bonding filling states for high-power light-emitting diode devices , 2014 .

[4]  Seung-Hwan Yu,et al.  Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications , 2012 .

[5]  Samuel Graham,et al.  Development of a thermal resistance model for chip-on-board packaging of high power LED arrays , 2012, Microelectron. Reliab..

[6]  S. Kim,et al.  Comparison of thermal performance between plate-fin and pin-fin heat sinks in natural convection , 2015 .

[7]  Jing Wang,et al.  Thermal model design and analysis of the high-power LED automotive headlight cooling device , 2015 .

[8]  Douglas C. Montgomery,et al.  Response Surface Methodology: Process and Product Optimization Using Designed Experiments , 1995 .

[9]  Samuel Graham,et al.  Thermal effects in packaging high power light emitting diode arrays , 2009 .

[10]  Daming Sun,et al.  Orientation effects on natural convection heat dissipation of rectangular fin heat sinks mounted on LEDs , 2014 .

[11]  Jiri Jakovenko,et al.  Thermal resistance investigations on new leadframe-based LED packages and boards , 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[12]  Kwan-Soo Lee,et al.  Optimum design of a radial heat sink under natural convection , 2011 .

[13]  Frank P. Incropera,et al.  Fundamentals of Heat and Mass Transfer , 1981 .

[14]  Daeseok Jang,et al.  Correlation of cross-cut cylindrical heat sink to improve the orientation effect of LED light bulbs , 2015 .

[15]  Gordon Elger,et al.  Inline thermal transient testing of high power LED modules for solder joint quality control , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

[16]  S.Y.R. Hui,et al.  Comparative Study on the Structural Designs of LED Devices and Systems Based on the General Photo-Electro-Thermal Theory , 2010, IEEE Transactions on Power Electronics.

[17]  Kwan-Soo Lee,et al.  Optimum design of a radial heat sink with a fin-height profile for high-power LED lighting applications , 2014 .

[18]  Ming-Tzer Lin,et al.  Heat dissipation design and analysis of high power LED array using the finite element method , 2012, Microelectron. Reliab..

[19]  Chun Zhang,et al.  Thermal design and simulation of automotive headlamps using white LEDs , 2014, Microelectron. J..

[20]  Hsueh-Han Wu,et al.  A study on the heat dissipation of high power multi-chip COB LEDs , 2012, Microelectron. J..

[21]  S. Hui,et al.  A General Photo-Electro-Thermal Theory for Light Emitting Diode (LED) Systems , 2009, IEEE Transactions on Power Electronics.

[22]  Jing Wang,et al.  Thermal Analysis and Optimization of High Power LED Automotive Headlamp Cooling Device , 2013 .

[23]  T. Hung,et al.  Effects of Thermal Radiation for Electronic Cooling on Modified PCB Geometry under Natural Convection , 2007 .

[24]  Jun Yao,et al.  Modelling conjugate flow and heat transfer in a ventilated room for indoor thermal comfort assessment , 2014 .

[25]  A. Bejan,et al.  Heat transfer handbook , 2003 .

[26]  K. Ashok,et al.  Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package , 2012 .

[27]  Sheng Liu,et al.  Design and optimization of horizontally-located plate fin heat sink for high power LED street lamps , 2009, 2009 59th Electronic Components and Technology Conference.