Optically Guiding Substrates for Low Cost Optical Interconnects in Stacked Multichip Module and Chip Scale Packaging
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Paul Cook | Franz Haas | F. Haas | P. Cook
[1] L. A. Hornak. Optical Interconnections For Wafer-Scale Integrated And Hybrid-Wafer-Scale Integrated Architectures , 1988, Other Conferences.
[2] Rao Tummala. Multichip packaging-a tutorial , 1992 .
[3] L. W. Schaper. Design of multichip modules , 1992 .
[4] R. C. Weast. CRC Handbook of Chemistry and Physics , 1973 .
[5] K. Young,et al. Optical interconnections within multichip modules , 1993 .
[6] A Guha,et al. Optical interconnections for massively parallel architectures. , 1990, Applied optics.
[7] Larry Gilg. Known Good Die , 1997, J. Electron. Test..
[8] Davis H. Hartman,et al. Digital High Speed Interconnects: A Study Of The Optical Alternative , 1986 .
[9] B Dhoedt,et al. Optical free-space board-to-board interconnect: options for optical pathways. , 1992, Applied optics.
[10] Ashok V. Krishnamoorthy,et al. Performance comparison between optoelectronic and VLSI multistage interconnection networks , 1991 .
[11] J Jahns,et al. Optical interconnects using top-surface-emitting microlasers and planar optics. , 1992, Applied optics.
[12] E. J. Rymaszewski,et al. Microelectronics Packaging Handbook , 1988 .
[13] Marc E. Brown,et al. Patent pending , 1995 .