Resistance Measurements of BGA Contacts During Reliability Tests

For mechanical fatigue tests were designed special test models of BGA package and test board, for measurements of solder joints and ball contact resistance by four-point method, with elimination of paths resistance. This solution allows the early and partial failures detection. The mechanical fatigue test was performed on developed mechanical test stand. The resistance was measured before, during and after reliability test. The preliminary results showed that evaluated test method can be applied for accelerated verification of soldering process especially during implementation of lead-free technology.