Constructal entransy dissipation minimization for 'volume-point' heat conduction

The 'volume to point' heat conduction problem, which can be described as to how to determine the optimal distribution of high conductivity material through the given volume such that the heat generated at every point is transferred most effectively to its boundary, has became the focus of attention in the current constructal theory literature. In general, the minimization of the maximum temperature difference in the volume is taken as the optimization objective. A new physical quantity, entransy, has been identified as a basis for optimizing heat transfer processes in terms of the analogy between heat and electrical conduction recently. Heat transfer analyses show that the entransy of an object describes its heat transfer ability, just as the electrical energy in a capacitor describes its charge transfer ability. Entransy dissipation occurs during heat transfer processes, as a measure of the heat transfer irreversibility with the dissipation related thermal resistance. By taking equivalent thermal resistance (it corresponds to the mean temperature difference), which reflects the average heat conduction effect and is defined based on entransy dissipation, as an optimization objective, the 'volume to point' constructal problem is re-analysed and re-optimized in this paper. The constructal shape of the control volume with the best average heat conduction effect is deduced. For the elemental area and the first order construct assembly, when the thermal current density in the high conductive link is linear with the length, the optimized shapes of assembly based on the minimization of entransy dissipation are the same as those based on minimization of the maximum temperature difference, and the mean temperature difference is 2/3 of the maximum temperature difference. For the second and higher order construct assemblies, the thermal current densities in the high conductive link are not linear with the length, and the optimized shapes of the assembly based on the minimization of entransy dissipation are different from those based on the minimization of the maximum temperature difference. For the same parameters, the constructs based on minimization of entransy dissipation and the constructs based on minimization of the maximum temperature difference are compared, and the results show that the constructs based on entransy dissipation can decrease the mean temperature difference better than the constructs based on minimization of the maximum temperature difference and therefore can improve the conductive ability greatly. Because the idea of entransy describes the heat transfer ability more suitably, all of the heat conduction constructal problems may be re-optimized based on it.