Investigation of Dust Test and Modeling of Dusts Ingression

Dust is a causative factor in connector's failure. To evaluate dust influence on the reliability of electric/electronic devices and connectors, dust tests are required for both ingression and contact behavior. Dust influence involves two typical stages: deposition and redistribution. Many factors such as air flowing, particle size, connector structure, electromagnetic characteristic of electronic devices, electric charge of dusts and dynamic environments may affect the results. Normally, vibration including bouncing is used to simulate dust ingression in the test. However, the results are not quite consistent with real situation. In this paper, for improving dust test method, the study of some influencing factors in the ingress of dust into electronic devices is performed. Dynamic models of finite element method were established for the evaluation of these influences. Based on analysis, an improved test method is presented.