Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations

This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations.The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution.The global placement is based on a top-down recursive bisection framework.The partitioning algorithm is used in the bisectioning to impact the wire density uniformity.Tests show that,with a 10% constraint,the partitioning produces solutions with more balanced edge weights that are 837% better than from hMetis,1039.1% better than MLPart,and 762.9% better than FM in terms of imbalance proportion and that this global placement algorithm improves ROOSTER with a more uniform wire distribution by 3.1% on average with an increased wire length of only 3.0%.