论文信息 - Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading

Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading

The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is shown that an in-situ capacitance measurement is a convenient method to detect these failures unambiguously. Finite Element simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given.

[1] H. Reichl,et al. Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[2] J. Toonder,et al. Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation , 2003 .

[3] Wilhelm Warta,et al. Lock-in thermography , 2003 .

[4] Bharat Bhushan,et al. Applied scanning probe methods , 2006 .

[5] Bernd Michel,et al. Displacement and Strain Field Measurements from SPM Images , 2004 .

[6] Herbert Reichl,et al. Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon , 2006 .

[7] I. C. Ume,et al. Online-offline laser ultrasonic quality inspection tool for multi-layer chip capacitors , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[8] H. Reichl,et al. Improved Reliability of Leadfree Flip Chip Assemblies Using Direct Underfilling by Transfer Molding , 2006, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.