论文信息 - Progress in shingle interconnection based on electrically conductive adhesives at Fraunhofer ISE - 字舞流文

Progress in shingle interconnection based on electrically conductive adhesives at Fraunhofer ISE

E. Fokuhl | A. Kraft | A. Münzer | P. Baliozian | V. Nikitina | N. Klasen | Torsten Rößler | Daniel von Kutzleben

[1] Yan Wang,et al. Hotspot development and shading response of shingled PV modules , 2020 .

[2] Matteo Bertazzo,et al. Shingling Technology For Cell Interconnection: Technological Aspects And Process Integration , 2018, Energy Procedia.

[3] G. Beaucarne,et al. Materials Challenge for Shingled Cells Interconnection , 2016 .

[4] Harry Wirth,et al. Unified methodology for determining CTM ratios: Systematic prediction of module power☆ , 2014 .

[5] D. Lu,et al. A study of lubricants on silver flakes for microelectronics conductive adhesives , 1999 .

[6] H. Atwater. Microwave Measurement of Semiconductor Carrier Lifetimes , 1960 .