Preliminary Testing Results For A New X-Ray Stepper

Preliminary testing results for a new, commercially available soft x-ray proximity stepper are presented. Total system performance (i.e., overlay precision, alignment precision, and critical dimension control) is under investigation using electrical probe structures and scanning electron microscopy (SEM). Preliminary results indicate that the total system performance is consistent with that required for 0.5 μm device design rules. Process latitude data will be presented for several conventional novolak-based resists as well as for an e-beam novolak-based resist. Sensitivities have been obtained over the range of 5 to 400 mJ/cm2. The absence of measurable reflectivity coefficients for nearly normal incident soft x-rays allows one to perform stepper testing with nonstandard substrates. The stable source, large process latitude for conventional resists, and substrate insensitivity allow stepper use without the need to run "send ahead" wafers. The high "MTF" and lack of imaging aberrations allow the use of unbiased reticle patterns with excellent pattern replication on a variety of substrates. Preliminary performance of the alignment system, stage, and gap control imply that overlay consistent with 0.50 μm design rules is achievable.