Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites

Abstract The efficient heat dissipation of electronic equipment is very important, its heat dissipation performance directly determines the life of the equipment itself. A hand-held electronic communications equipment, when used in surface temperature is exorbitant, need to heat dissipation equipment efficiently, to ensure that the use of comfort in the handheld. In accordance with this requirement, this article presents a flexible composite material based on nano-efficient cooling methods that can keep the layout, through the improvement of internal thermal path, it can achieve the effective heat dissipation. The network thermal resistance method is used to analyze the heat transfer in the equipment, and the thermal analysis of the local thermal resistance is carried out. At the same time, through the modeling of electronic equipment and the analysis of finite elements, the temperature drop of the equipment after improvement is accurately judged. Finally, the device experimental performance comparison before and after the optimization of the standby mode and working mode is verified. The results show that the optimized equipment heat source temperature can be reduced by up to 8.5°C, the surface temperature of the equipment can be reduced by about 5°C∼7°C, and the final control equipment in the steady standby state of the temperature of about 39±0.5°C, to ensure the comfort of use, and also improved the service life of the equipment. The efficient thermal design of electronic equipment based on flexible nanocomposites can provide a convenient and reliable cooling solution for high-heat flow density devices.

[1]  Paolo Maffezzoni,et al.  Compact modeling of electrical devices for electrothermal analysis , 2003 .

[2]  Gerald M. Saidel,et al.  Thermal Model for Fast Simulation During Magnetic Resonance Imaging Guidance of Radio Frequency Tumor Ablation , 2004, Annals of Biomedical Engineering.

[3]  Xintian Liu,et al.  Structural optimization of lithium-ion battery for improving thermal performance based on a liquid cooling system , 2019, International Journal of Heat and Mass Transfer.

[4]  D. Florea,et al.  Design and operation of a Tesla-type valve for pulsating heat pipes , 2017 .

[5]  H. Kapeller,et al.  Comparison of a CFD Analysis and a Thermal Equivalent Circuit Model of a TEFC Induction Machine With Measurements , 2009, IEEE Transactions on Energy Conversion.

[6]  A. Bar-Cohen,et al.  Design and optimization of air-cooled heat sinks for sustainable development , 2002 .

[7]  T. Suwa,et al.  Multidisciplinary Placement Optimization of Heat Generating Electronic Components on a Printed Circuit Board in an Enclosure , 2007, IEEE Transactions on Components and Packaging Technologies.

[9]  Shinji Nakagawa,et al.  Study on the chimney effect in natural air‐cooled electronic equipment casings under inclination: Proposal of a thermal design correlation that includes the porosity coefficient of an outlet opening , 2006 .

[10]  Han Yuan,et al.  Identification of viscosity and solid fraction in slurry pipeline transportation based on the inverse heat transfer theory , 2019 .

[11]  Fu Guicui,et al.  Application research on thermal analysis software of electronic systems , 2003 .

[12]  M. S. Iqbal,et al.  Kinetics and mechanism of thermal degradation of pentose- and hexose-based carbohydrate polymers. , 2012, Carbohydrate polymers.

[13]  R. Velraj,et al.  Effect of porosity and the inlet heat transfer fluid temperature variation on the performance of cool thermal energy storage system , 2007 .

[14]  Chen He,et al.  The Study on Thermal Analysis Method of PCB , 2020, IOP Conference Series: Materials Science and Engineering.

[15]  J. Kwak,et al.  Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications , 2019, Journal of Electronic Packaging.

[16]  Lian-Tuu Yeh,et al.  Thermal management of microelectronic equipment : heat transfer theory, analysis methods, and design practices , 2002 .

[17]  Liyi Shi,et al.  Highly thermally conductive polypropylene/graphene composites for thermal management , 2020 .

[18]  Elias P. Zafiropoulos,et al.  Methodology for the optimal component selection of electronic devices under reliability and cost constraints , 2007, Qual. Reliab. Eng. Int..

[19]  S. Nakagawa,et al.  Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes) , 2011 .

[20]  Hamid Hadim,et al.  Multidisciplinary placement optimization of heat generating electronic components on printed circuit boards , 2007 .

[21]  Frede Blaabjerg,et al.  Reliability-oriented environmental thermal stress analysis of fuses in power electronics , 2017, Microelectron. Reliab..

[22]  Mengxuan Song,et al.  Design of the structure of battery pack in parallel air-cooled battery thermal management system for cooling efficiency improvement , 2019, International Journal of Heat and Mass Transfer.

[23]  B. Chambers,et al.  Application of CFD Technology to electronic thermal management , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[25]  M. Tencer,et al.  Arrhenius average temperature: the effective temperature for non-fatigue wearout and long term reliability in variable thermal conditions and climates , 2004, IEEE Transactions on Components and Packaging Technologies.

[26]  A. F. Zubair,et al.  Thermal Management of Electronic Components by Using Computational Fluid Dynamic (CFD) Software, FLUENTTM in Several Material Applications (Epoxy, Composite Material & Nanosilver) , 2013 .