High-resolution three-dimensional imaging by synchrotron-radiation computed laminography

The methodical development and first instrumental implementation of computed laminography / tomosynthesis using synchrotron radiation are presented. The technique was developed for three-dimensional imaging of flat and laterally extended objects with high spatial resolution. This paper introduces the fundamental principle of the imaging process and discusses the method's particularities in comparison to computed tomography and computed laminography / digital tomosynthesis. Introducing a simple scanning geometry adapted to the particular experimental conditions of synchrotron imaging set-ups (such as the stationary source and a parallel beam) allows us to combine the advantages of laminography and those provided by synchrotron radiation, for instance monochromatic radiation in order to avoid beam hardening artefacts, high beam intensity for achieving high spatial resolution and fast scanning times or spatial coherence for exploiting phase contrast. The potential of the method for three-dimensional imaging of microelectronic devices is demonstrated by examples of flip-chip bonded and wire-bonded devices.

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