Improved Ripple Current Capability with Facedown Terminations
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The facedown termination design was originally devised to improve volumetric efficiency and lower ESL for tantalum surface mount capacitors. These goals have been met with this design change. It has also been found that this termination design improves power capability in a manner that is similar to power semiconductors that have been designed with this termination concept. The thermal resistance is dramatically decreased which creates a much more efficient transfer of heat out of this package. The power capability of these capacitors is determined by an allowable temperature rise and the ripple current is derived from this power and the ESR of the device at that temperature. We will demonstrate the changes in ESL, the wider impedance response allowing a reduced ceramic count, and the higher ripple capability created by the switch to this package.