11E-3 A Thermally Stable CMOS Oscillator Using Temperature Compensated FBAR

This paper presents a passively temperature compensated CMOS oscillator utilizing Film Bulk Acoustic Resonator (FBAR). The resonator exhibiting f-Q product of 2~3times1012 sec-1 is comprised of molybdenum (Mo), aluminum nitride (AlN), and a compensation material that has positive temperature coefficient of Young's modulus. The 600 MHz oscillator consumes 6.6 mW from a 3.3 V supply and achieves an excellent phase noise performance of -102 dBc/Hz, -132 dBc/Hz, and -151 dBc/Hz at 1 kHz, 10 kHz, and 100 kHz carrier offset, respectively. The oscillator's temperature-dependent frequency drift is less than 80 parts per million (ppm) over a temperature range of -35 to +85degC.

[1]  C. Nguyen,et al.  Low phase noise array-composite micromechanical wine-glass disk oscillator , 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

[2]  E. Kim,et al.  Temperature-compensated film bulk acoustic resonator above 2 GHz , 2005 .

[3]  A. Ballato,et al.  Advances in high-Q piezoelectric resonator materials and devices , 1994, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[4]  R. Ruby 11E-2 Review and Comparison of Bulk Acoustic Wave FBAR, SMR Technology , 2007, 2007 IEEE Ultrasonics Symposium Proceedings.

[5]  John D. Larson,et al.  Measurement of Effective kt 2 , Q, Rp, Rs vs. Temperature for Mo/AlN FBAR Resonators , 2002 .

[6]  Thomas W. Kenny,et al.  Temperature-compensated high-stability silicon resonators , 2007 .

[7]  Wan-Thai Hsu Vibrating RF MEMS for Timing and Frequency References , 2006, 2006 IEEE MTT-S International Microwave Symposium Digest.

[8]  Wei Pang,et al.  Temperature-Compensated Film Bulk Acoustic , 2005 .