Radiation-induced back channel leakage in 60 MeV-proton-irradiated 0.10 /spl mu/m-CMOS partially depleted SOI MOSFETs

ln this paper, the dqradath of 0.10 p-CMOS Partially Depteted (PD) SO1 MOSFETs subjected to 60 MeV proton irradiation for space applications assessment is analyzed. It is observed a radiation-induced increase of the leakage current in the subthreshold region of the NMOSFETs characteristics, which is more important in the case of mounted devices irradiated under bias. By studying the static and transient characteristics on devices with different geometries and bias conditions, the degradation is demonstrated to be originated by positive charge trapping in the buried oxide, inducing an edge parasitic back channel conduction. The effective density of trapped holes is estimated to be around 7.510" chargedcm' for the devices biased during the irradiation, whereas this is found to be about three times smaller in the case of the devices not biased during the irradiation. Under the studied experimental conditions, no significant changes are observed in the above threshold region of the N and PMOSFETs characteristics, making this technology suitable for space applications. Furthermore, the irradiation is not found to significantly change neither the magnitude nor the position of the Electron Valence Band gate tunneling-induced 211d peak of the transconductance, characteristic of these ultrathin gate oxide PD SO1 transistors. This is in agreement with the results obtained from non-irradiated devices measured at pclsitive back gate voItages, what is found to generate an irradiation-like parasitic back channel conduction. It is also derived that no significant changes in the majority carriers generation and recombination lifetimes are introduced by the irradiation, which is supported by the results coming from the measurements of front gate switch-off ID transients. Index Terms-Buried oxide, floating body effects, proton irradiation, radiation effects, silicon on insulator (SOI), switch off transient, total dose effects, transconductance peak.

[1]  D. C. Mayer Modes of operation and radiation sensitivity of ultrathin SOI transistors , 1989, IEEE SOS/SOI Technology Conference.

[2]  A. Mercha,et al.  Impact of gate tunneling floating-body charging on drain current transients of 0.10 μm-CMOS partially depleted SOI MOSFETs , 2004 .

[3]  D. C. Mayer Modes of operation and radiation sensitivity of ultrathin SOI transistors , 1990 .

[4]  J. R. Schwank Advantages and limitations of silicon-on-insulator technology in radiation environments , 1997 .

[5]  Sorin Cristoloveanu,et al.  Generation-recombination transient effects in partially depleted SOI transistors: systematic experiments and simulations , 1998 .

[6]  J. L. Pelloie,et al.  Worst-case bias during total dose irradiation of SOI transistors , 2000 .

[7]  A. Mercha,et al.  "Linear kink effect" induced by electron valence band tunneling in ultrathin gate oxide bulk and SOI MOSFETS , 2003 .

[8]  Daniel M. Fleetwood,et al.  Correlation between Co-60 and X-ray radiation-induced charge buildup in silicon-on-insulator buried oxides , 2000 .

[9]  J. L. Pelloie,et al.  Total dose effects on a fully-depleted SOI NMOSFET and its lateral parasitic transistor , 1997 .

[10]  G.W. Turner,et al.  Effects of ionizing radiation on n-channel MOSFET's fabricated in zone-melting-recrystallized Si films on SiO2 , 1982, IEEE Electron Device Letters.

[11]  S. Cristoloveanu,et al.  New Mechanism of Body Charging in Partially Depleted SOI-MOSFETs with Ultra-thin Gate Oxides , 2002, 32nd European Solid-State Device Research Conference.

[12]  Carrier recombination and thin gate oxide effects in floating body SOI MOSFETs: influence of the device geometries and architectures , 2002, 2002 IEEE International SOI Conference.

[13]  Anestis Antoniadis,et al.  Modification of parasitic edge leakage in LOCOS-isolated SOI MOSFETS using back-gate stress , 1996, 1996 IEEE International SOI Conference Proceedings.

[14]  P. Dodd,et al.  Radiation effects in SOI technologies , 2003 .

[15]  J. Leray,et al.  Impact of technology scaling in SOI back-channel total dose tolerance, a 2-D numerical study using self-consistent oxide code , 1999, 1999 Fifth European Conference on Radiation and Its Effects on Components and Systems. RADECS 99 (Cat. No.99TH8471).

[16]  D. Schroder,et al.  Measurement of carrier generation lifetime in SOI devices , 1999 .

[17]  M. Haond Lateral isolation in SOI CMOS technology , 1990, 1990 IEEE SOS/SOI Technology Conference. Proceedings.