ArR-DTM: A routing-based DTM for 3D NoCs by adaptive degree regulation

Three dimensional (3D) networks-on-chip (NoCs) is beneficial to performance improvement, but suffers severe thermal issues. Because of the fast packet switching activity and small area, an NoC router might even show higher power density than a process element, quite easily forming a thermal hotspot. Throttling based dynamic thermal managements (DTMs) help for fast cooling, but easily results in network congestion and introduces large cost. This paper proposed an efficient routing-based DTM scheme (ArR-DTM), which tries to balance the thermal distribution by providing complementary adaptive degree for lateral planes and finish thermal migration by regulating the adaptive degree in vertical direction. Experiments show that, under the same thermal limit, there is 13.1% to 23.8% performance improvement compared to the fully throttling based DTMs.

[1]  Kevin Skadron,et al.  HotSpot: a compact thermal modeling methodology for early-stage VLSI design , 2006, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[2]  Lei Zhou,et al.  The Adaptive Thermal and Traffic-Balanced Routing algorithm based on temperature analysis and traffic statistics , 2015, IEICE Electron. Express.

[3]  Partha Pratim Pande,et al.  Networks-on-Chip in a Three-Dimensional Environment: A Performance Evaluation , 2009, IEEE Transactions on Computers.

[4]  An-Yeu Wu,et al.  Transport-layer-assisted routing for runtime thermal management of 3D NoC systems , 2013, TECS.

[5]  Terrence S. T. Mak,et al.  Design and Implementation of Dynamic Thermal-Adaptive Routing Strategy for Networks-on-Chip , 2014, 2014 22nd Euromicro International Conference on Parallel, Distributed, and Network-Based Processing.

[6]  S. Borkar,et al.  An 80-Tile Sub-100-W TeraFLOPS Processor in 65-nm CMOS , 2008, IEEE Journal of Solid-State Circuits.

[7]  Li Shang,et al.  Thermal Modeling, Characterization and Management of On-Chip Networks , 2004, 37th International Symposium on Microarchitecture (MICRO-37'04).

[8]  An-Yeu Wu,et al.  Traffic-thermal mutual-coupling co-simulation platform for three-dimensional Network-on-Chip , 2010, Proceedings of 2010 International Symposium on VLSI Design, Automation and Test.

[9]  An-Yeu Wu,et al.  Topology-Aware Adaptive Routing for Nonstationary Irregular Mesh in Throttled 3D NoC Systems , 2013, IEEE Transactions on Parallel and Distributed Systems.

[10]  Ge-Ming Chiu,et al.  The Odd-Even Turn Model for Adaptive Routing , 2000, IEEE Trans. Parallel Distributed Syst..

[11]  Hannu Tenhunen,et al.  Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip , 2012, IET Circuits Devices Syst..