RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology
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J. Laskar | A. Sutono | M.F. Davis | K. Lim | V. Sundaram | G. White | R. Tummala | J. Laskar | K. Lim | A. Sutono | R. Tummala | V. Sundaram | G.E. White | J. Hobbs | J. Hobbs | M.F. Davis
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