The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements

[1]  Caiju Li,et al.  Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry , 2022, Microelectronics Reliability.

[2]  C. Peng,et al.  Influence of cobalt content on microstructure and corrosion performance of extruded Sn-9Zn solder alloys , 2020, Journal of Central South University.

[3]  A. E. Hammad,et al.  Impact of permanent magnet stirring on dendrite growth and elastic properties of Sn–Bi alloys revealed by pulse echo overlap method , 2018, Journal of Alloys and Compounds.

[4]  Zhipeng Ma,et al.  Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy , 2017 .

[5]  Z. Zhang,et al.  Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain , 2017 .

[6]  A. F. Saad,et al.  The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn–6.5Zn–xCu Pb-free solders , 2015 .

[7]  Sanjay Tikale,et al.  Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate , 2015 .

[8]  A. E. Hammad,et al.  Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions , 2013 .

[9]  A. El-Daly,et al.  Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders , 2013 .

[10]  A. E. Hammad,et al.  Structural and elastic properties of eutectic Sn-Cu lead-free solder alloy containing small amount of Ag and in , 2011 .

[11]  A. E. Hammad,et al.  Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys , 2010 .

[12]  R. Shalaby.  Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy , 2010 .

[13]  A. Fawzy,et al.  Deformation characteristics of Al-4043 alloy , 2010 .

[14]  M. Rabah,et al.  Structural and elastic properties of antiperovskites XNBa3 (X=As, Sb) under pressure effect , 2009 .

[15]  W. Zhou,et al.  Structural, elastic and electronic properties of intermetallics in the Pt–Sn system: A density functional investigation , 2009 .

[16]  Hamideh Khanbareh,et al.  Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys , 2009 .

[17]  A. Abushoffa,et al.  Stripping Voltammetric, Conductance and Anodic Linear Polarization Analysis on Dissolution of Electrodeposited Zinc- Cobalt Alloy , 2007, International Journal of Electrochemical Science.

[18]  Mike Roellig,et al.  The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[19]  Gang Wang,et al.  Super Plastic Bulk Metallic Glasses at Room Temperature , 2007, Science.

[20]  Meng Zhang,et al.  On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material , 2007 .

[21]  Anish Kumar,et al.  Correlation between ultrasonic shear wave velocity and Poisson’s ratio for isotropic solid materials , 2003 .

[22]  R. Mccabe,et al.  Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin , 2002 .

[23]  蒋君祥.  Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions , 2008 .