Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
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P. Soussan | W. De Raedt | B. Nauwelaers | G. Carchon | B. Majeed | B. Majeed | P. Soussan | W. Ruythooren | B. Nauwelaers | W. De Raedt | G. Carchon | W. Ruythooren | G. Posada | G. Posada | N. Pham | D. Sabuncouglu | N. Pham | D. Sabuncouglu
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