The development of the Fan-in Package-on-Package

Package-on-package (PoP) has become the preferred means of stacking logic processors and memory for advanced mobile phones. The challenge is to reduce size, thickness, and cost of this PoP solution. The fan-in package-on-package (FiPoP) has been developed to address such concerns as well as enable more device integration while maintaining the desirable PoP business model. This paper will detail the development of the FiPoP to meet the size, thickness, flatness, and package level and board level reliability requirements of the typical handset application.

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