High-frequency EMC design verification through full-wave simulations and measurements in Reverberation Chamber

In this paper we present a novel three dimensional (3D) electromagnetic (EM) simulation technique to analyse radiation characteristics of various electrical and mechanical components used on printed circuit board (PCB) and electronic chassis. Several cases like optical connectors, “special” EMI features on a chassis, heat sinks and air-vent structure are verified in simulation and measurements from 1 to 40 GHz. Excellent co-relation between simulations and measurements is achieved, thus the new simulation methodology providing an efficient way to analyse EMC issues at component level early during the design phase.

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