반도체 제조 가상계측 공정변수를 이용한 웨이퍼 수율 예측 / A Prediction of Wafer Yield Using Product Fabrication Virtual Metrology Process Parameters in Semiconductor Manufacturing

Yield prediction is one of the most important issues in semiconductor manufacturing. Especially, for a fast-changing environment of the semiconductor industry, accurate and reliable prediction techniques are required. In this study, we propose a prediction model to predict wafer yield based on virtual metrology process parameters in semiconductor manufacturing. The proposed prediction model addresses imbalance problems frequently encountered in semiconductor processes so as to construct reliable prediction model. The effectiveness and applicability of the proposed procedure was demonstrated through a real data from a leading semiconductor industry in South Korea.

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