Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield
暂无分享,去创建一个
[1] C. Melton. The effect of reflow process variables on the wettability of lead-free solders , 1993 .
[2] S. O. Andersen. Progress by the electronics industry on protection of stratospheric ozone , 1990, 40th Conference Proceedings on Electronic Components and Technology.
[3] E. P. Wood,et al. In search of new lead-free electronic solders , 1994 .
[4] R. Faure,et al. Introduction to operations research , 1968 .
[5] Sungho Jin,et al. New, lead-free solders , 1994 .
[6] K. Feldmann,et al. Disassembly of electronic products , 1994, Proceedings of 1994 IEEE International Symposium on Electronics and The Environment.
[7] V. Rich. Personal communication , 1989, Nature.
[8] Jeff R. Dieffenbach,et al. Body-in-white material systems: A life-cycle cost comparison , 1993 .
[9] G. Humpston,et al. Lead-free solders for electronic assembly , 1994 .
[10] Gregory A. Keoleian. Product Life Cycle Assessment to Reduce Health Risks and Environmental Impacts , 1994 .
[11] Ad J. de Ron,et al. Disassembly and recycling of electronic consumer products: an overview , 1995 .
[12] Laurence A. Wolsey,et al. Integer and Combinatorial Optimization , 1988, Wiley interscience series in discrete mathematics and optimization.
[13] Jane C. Ammons,et al. A Product and Process Selection Model with Multidisciplinary Environmental Considerations , 1999, Oper. Res..
[14] N. Lee,et al. A Novel Lead-Free Solder Replacement , 1994 .
[15] David J. Williams,et al. Challenges in determining electronics equipment take-back levels , 1998 .