Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology
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L. Nanver | Y. Civale | K. Buisman | M. Popadic | T. Scholtes | L. La Spina | E. Goudena | H. Schellevis | F. Sarubbi | S. Milosavljević | G. Lorito | V. Gonda