论文信息 - Implementation of a viscoplastic substrate creep model in the thermomechanical simulation of the WAAM process - 字舞流文

Implementation of a viscoplastic substrate creep model in the thermomechanical simulation of the WAAM process

M. Leitner | S. Springer | F. Grün | B. Oberwinkler | T. Gruber | M. Lasnik | A. Röcklinger