The optimization of LBC6 power/mixed-signal IC BiCMOS process

A 30 V, 0.5 /spl mu/m, triple level metal (TLM) + thick top copper metal, power-BiCMOS technology for Hard Disk Drive (HDD) servo applications is described. Based on a die area analysis, a vital few components and process features were optimized over the prior-generation process, resulting in a 40% die size reduction for typical products. Insight into this optimization effort is provided.