Plasma etch/deposition modeling: A new dynamically coupled multiscale code and comparison with experiment

Next-generation plasma-process modeling tools can provide new insight into process dynamics by resolving the diverse length and time scales present in reactor systems. The length scales range from the size of the reactor (∼10 cm) to surface details (∼100 nm), and time scales from electron sheath-transit times (nanoseconds) to total process time (minutes). Other key features include dynamic coupling of the plasma and solid (particles and fields), and the ability to model realistic surface interactions (deposition, etch, sputter, polymerization, etc.). A computational tool has been developed which provides all of these features through the coupling of heterogeneous code modules [hybrid plasma, particle in cell (PIC) plasma and solid surface chemistry] and through time-sampling techniques. The hybrid code (particle ions, fluid electrons) provides the basis for modeling the large-scale plasma reactor using a finite-element mesh to represent complex reactor geometries. The PIC code is used in the dynamic sheat...