Extraction of compact models for MEMS/MOEMS package-device codesign
暂无分享,去创建一个
MEMS package requirements are by their nature application specific. MEMS devices are often inherently sensitive to stress induced by their packages sand often need direct access to the environment. Therefore, understanding the influence of packaging on MEMS is critical to a successful coupled package-device co-design. Here, an automated package-device interaction simulator has been developed. The simulator uses Finite Element Method models for both the package and the device analysis and ties the result of the simulations together through parametric models. This so- called Compact Model Extraction is an efficient way to solve complex problems. Several examples illustrate the use of this technique.