Validation of compact conduction models of BGA under an expanded boundary condition set

This work focuses the application of compact conduction model (CCM) creation approach to BGA packages under steady state conditions. The procedure of creating CCM from detailed BGA model is demonstrated. The authors have imposed realistic boundary condition scenarios that are likely to test the boundary condition independence necessary for the compact modeling approach. Results showed acceptable agreement in die temperature and heat flow predictions from simulations using detailed BGA models and their CCM equivalents.

[1]  H. Vinke,et al.  Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[2]  G. B. Kromann,et al.  The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[3]  A. Bar-Cohen,et al.  Thermal characterization of chip packages-evolutionary development of compact models , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[4]  M. Yovanovich,et al.  General solution of constriction resistance within a compound disk , 1979 .

[5]  T. M. Ying,et al.  A heat spreading resistance model for anisotropic thermal conductivity materials in electronic packaging , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

[6]  K. Ramakrishna,et al.  Thermal sub-modeling of the wirebonded plastic ball grid array package , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[7]  Sarang Shidore,et al.  A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package , 2001 .

[8]  B. Joiner,et al.  Measurement and simulation of junction to board thermal resistance and its application in thermal modeling , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

[9]  H. I. Rosten,et al.  Development, validation and application of a thermal model of a plastic quad flat pack , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

[10]  K. Karimanal,et al.  Use of zero thickness conducting plate object in electronics cooling applications of CFD , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).