Technical approaches towards ultra-high power density SiC inverter in electric vehicle applications
暂无分享,去创建一个
[1] Gui-Jia Su,et al. Current source inverter based traction drive for EV battery charging applications , 2011, 2011 IEEE Vehicle Power and Propulsion Conference.
[2] Zheng Chen,et al. Electrical Integration of SiC Power Devices for High-Power-Density Applications , 2013 .
[3] F. Crescimbini,et al. Low-voltage power electronics building block for automotive applications , 2006, Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06..
[4] Xuhui Wen,et al. An improved automatic layout method for planar power module , 2016, 2016 IEEE Applied Power Electronics Conference and Exposition (APEC).
[5] S. Klengel,et al. Packaging material issues in high temperature power electronics , 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).
[6] J. Rabkowski,et al. Silicon Carbide Power Transistors: A New Era in Power Electronics Is Initiated , 2012, IEEE Industrial Electronics Magazine.
[7] Gui-Jia Su,et al. A segmented traction drive system with a small dc bus capacitor , 2012, 2012 IEEE Energy Conversion Congress and Exposition (ECCE).
[8] S. Chungpaiboonpatana,et al. Packaging of copper/low-k IC devices: a novel direct fine pitch gold wirebond ball interconnects onto copper/low-k terminal pads , 2004, IEEE Transactions on Advanced Packaging.
[9] M. A. Brubaker,et al. Integrated DC link capacitor/bus structures to minimize external ESL contribution to voltage overshoot , 2012, 2012 IEEE Transportation Electrification Conference and Expo (ITEC).
[10] Zhenxian Liang. Integrated double sided cooling packaging of planar SiC power modules , 2015, 2015 IEEE Energy Conversion Congress and Exposition (ECCE).
[11] G. Lu,et al. A Multichip Phase-Leg IGBT Module Bonded by Pressureless Sintering of Nanosilver Paste , 2017, IEEE Transactions on Device and Materials Reliability.
[12] Kaname Sasaki,et al. High-power-density Inverter Technology for Hybrid and Electric Vehicle Applications , 2014 .
[13] Zheyu Zhang,et al. Overview of Silicon Carbide Technology: Device, Converter, System, and Application , 2016 .
[14] Xuhui Wen,et al. Inverter output power density increasing technologies for EV/HEV applications , 2016, 2016 19th International Conference on Electrical Machines and Systems (ICEMS).
[15] Y. Mei,et al. Double-sided joining IGBT devices by pressureless sintering of nanosilver paste , 2016, 2016 International Conference on Electronics Packaging (ICEP).
[16] K. Hamada. SiC Device and Power Module Technologies for Environmentally Friendly Vehicles , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).