A new quality estimation methodology for mixed-signal and analogue ICs

IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimise the manufacturing test program.

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