Optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat flow equation

In this paper, an optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat equation is presented. The thermal solution has been achieved by the Kirchhoff transform and the 2-D Fourier transform. The electrothermal feedback has been implemented by calculating the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as spatial domain in which the heat equation has been solved.

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