Open Research Online Effects of current on early stages of focused ion beam nano-machining

In this report we investigate the effects of focused ion beam (FIB) machining at low doses in the range of 10 15 ions/cm 2 to 10 16 ions/cm 2 for currents below 300 pA on Si(100) substrates. The effects of similar doses with currents in the range 10pA to 300 pA were compared. The topography of resulting structures has been characterized using atomic force microscope, while crystallinity of the Si was assessed by means of Raman spectroscopy. These machining parameters allow a controllable preparation of structures either protruding from, or recessed into, the surface with nanometre precision.

[1]  I. Tittonen,et al.  Aluminum oxide mask fabrication by focused ion beam implantation combined with wet etching , 2013, Nanotechnology.

[2]  C. Anthony,et al.  Nano planar coil actuated micro paddle resonator for mass detection , 2011 .

[3]  C. Anthony,et al.  Effect of focused ion beam milling on microcantilever loss , 2011 .

[4]  S. Selberherr,et al.  Three-dimensional simulation of focused ion beam processing using the level set method , 2010, 2010 International Conference on Simulation of Semiconductor Processes and Devices.

[5]  Yuan Chen,et al.  Focused ion beam technology and application in failure analysis , 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

[6]  Matthias Steiner,et al.  Enhanced generation of single optically active spins in diamond by ion implantation. , 2010 .

[7]  I. Tittonen,et al.  The fabrication of silicon nanostructures by local gallium implantation and cryogenic deep reactive ion etching , 2009, Nanotechnology.

[8]  C. Anthony,et al.  Stress-induced curvature of focused ion beam fabricated microcantilevers , 2008 .

[9]  J. Miao,et al.  Fabrication of Si microstructures using focused ion beam implantation and reactive ion etching , 2008 .

[10]  Andrew M. Minor,et al.  Focused Ion Beam Microscopy and Micromachining , 2007 .

[11]  M. Posselt,et al.  Competition between damage buildup and dynamic annealing in ion implantation into Ge , 2006 .

[12]  R. Cowburn,et al.  Nanometer scale patterning using focused ion beam milling , 2005 .

[13]  B. Huey,et al.  Low-dose focused ion beam nanofabrication and characterization by atomic force microscopy , 2003 .

[14]  Li Wang Design optimization for two lens focused ion beam columns , 1997 .

[15]  C. Magee,et al.  An examination of the effect of dose rate on ion implanted impurity profiles in silicon , 1995 .

[16]  P. Seidel,et al.  Transport Characteristics and Structural Analysis of YBa2Cu3O7−x Thin Films Implanted with Argon Ions , 1995 .

[17]  P. Prewett,et al.  Focused ion beam repair: staining of photomasks and reticles , 1993 .

[18]  P. D. Prewett,et al.  Focused ion beams from liquid metal ion sources , 1991 .

[19]  P. Heard,et al.  Repair of opaque defects in photomasks using focused ion beams , 1987 .

[20]  J. W. Ward,et al.  Computer simulation of current density profiles in focused ion beams , 1987 .

[21]  Robert H. Reuss,et al.  Comparison of NPN transistors fabricated with broad beam and spatial profiling using focused beam ion implantation , 1986 .

[22]  M. Pham,et al.  Modification of the chemical properties of silicon by ion implantation with high doses of Ar and P , 1979 .

[23]  F. Trumbore,et al.  Solid solubilities of impurity elements in germanium and silicon , 1960 .