Research on crosstalk issue of through silicon via for 3D integration
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[1] Joungho Kim,et al. Active circuit to through silicon via (TSV) noise coupling , 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.
[2] Junho Lee,et al. Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[3] Kenneth Rose,et al. Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture , 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
[4] H. Reichl,et al. Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs) , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[5] Seungyoung Ahn,et al. Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs , 2011, 2011 12th International Symposium on Quality Electronic Design.
[6] M. Swaminathan,et al. Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems , 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.
[7] Herbert Reichl,et al. The impacts of dimensions and return current path geometry on coupling in single ended Through Silicon Vias , 2009, 2009 59th Electronic Components and Technology Conference.
[8] B. Dang,et al. 3D silicon integration , 2008, 2008 58th Electronic Components and Technology Conference.