Silicon carbide die sintering layer: manufacturing process optimization and modeling

[1]  S. Oliveri,et al.  Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling , 2021, Applied Sciences.

[2]  G. Sequenzia,et al.  Design and Process Optimization of a Sintered Joint for Power Electronics Automotive Applications , 2019, Lecture Notes in Mechanical Engineering.

[3]  J. Nicolics,et al.  Behaviour of Silver-Sintered Joints by Cyclic Mechanical Loading and Influence of Temperature , 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

[4]  Yifei Luo,et al.  Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling , 2019, IEEE Journal of Emerging and Selected Topics in Power Electronics.

[5]  Gaetano Bazzano,et al.  Thermal Analysis Approach for Predicting Power Device Lifetime , 2019, IEEE Transactions on Device and Materials Reliability.

[6]  Mingyu Li,et al.  Comparison of sintered silver micro and nano particles: from microstructure to property , 2018, International Conference on Electronic Materials and Packaging.

[7]  B. Wunderle,et al.  Silver Sintering in Power Electronics: The State of the Art in Material Characterization and Reliability Testing , 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

[8]  J. Lutz,et al.  Power cycling methods for SiC MOSFETs , 2017, 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD).

[9]  Wolfgang Schmitt,et al.  Silver sinter paste for SiC bonding with improved mechanical properties , 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

[10]  Jörg Franke,et al.  Requirements in power cycling for precise lifetime estimation , 2016, Microelectron. Reliab..

[11]  R. Doring,et al.  Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability , 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[12]  Andreas Fix,et al.  Failure mechanisms of sintered silver interconnections for power electronic applications , 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

[13]  S. Rzepka,et al.  Reliability issues for high temperature interconnections based on transient liquid phase soldering , 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[14]  Norbert Hofmann,et al.  The influence of thermal cycling methods on the interconnection reliability evaluation within IGBT modules , 2012, 2012 4th Electronic System-Integration Technology Conference.

[15]  J. Wilde,et al.  Assessment of thermo-mechanical stresses in Low Temperature Joining Technology , 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[16]  Andreas Schletz,et al.  Reliability assessment of sintered nano-silver die attachment for power semiconductors , 2010, 2010 12th Electronics Packaging Technology Conference.

[17]  Andreas Schletz,et al.  Power semiconductor joining through sintering of silver nanoparticles: Evaluation of influence of parameters time, temperature and pressure on density, strength and reliability , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

[18]  Klaus-Dieter Lang,et al.  Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

[19]  C. Gobl,et al.  Low temperature sinter technology die attachment for power electronic applications , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

[20]  G. Lu,et al.  Characterization of Low-Temperature Sintered Nanoscale Silver Paste for Attaching Semiconductor Devices , 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

[21]  S. Klaka,et al.  Reduction of thermomechanical stress by applying a low temperature joining technique , 1994, Proceedings of the 6th International Symposium on Power Semiconductor Devices and Ics.

[22]  H. Schwarzbauer,et al.  Novel large area joining technique for improved power device performance , 1989, Conference Record of the IEEE Industry Applications Society Annual Meeting,.

[23]  Ludwig Josef Balk,et al.  Scanning acoustic microscopy , 1986 .

[24]  A. Morozumi,et al.  Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules , 2015 .