The effect of strain rate and temperature on the tensile properties of Sn–3.5Ag solder

The tensile response of Sn-3.5% Ag solder was investigated and compared with that of a Sn-37% Pb eutectic solder at various strain rates from 2.38x10{sup -6} s{sup -1} to 2.38x10{sup -3} s{sup -1} over the temperature range from -50 deg. C to 150 deg. C. The relationship between tensile strength, {sigma} {sub UTS}, and strain rate, {epsilon}', for Sn-3.5Ag can be expressed by the equation {sigma} {sub UTS}=A{epsilon}' {sup m}. The influence of temperature on the strain rate sensitivity index m was very slight for Sn-3.5Ag, whereas the m values of Sn-37Pb increased strongly with increasing temperature. The relationship between the tensile strength of the Sn-3.5Ag alloy and temperature follows an Arrhenius law, and the activation energy for creep was found to be 78 kJ/mol, close to that for the pipe diffusion controlled creep of tin. The microstructure and fracture morphologies of both solders were observed with a scanning electron microscope. Ag{sub 3}Sn particles were observed in the primary {beta}-Sn in the Sn-3.5Ag solder by transmission electron microscope.