论文信息 - Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities

Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities

The evaluation of the thermal transient measurements may result in the time constant density function and the structure function of the measured structure. In this paper we show how these results can be used to detect die attach or soldering problems of packages. Another application of the method in detecting partial thermal resistances in the heat flow path is also presented and evaluated.

M. Rencz | V. Szekely | C. Villa | A. Morelli

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