Spheron Fan-In WLCSP Technology Qualification and Scale Up - 200 mm to 300 mm

Overview: Fan-In WLP plays crucial role on today's high density, high performance IC Packaging. 300 mm wafer processing addresses cost-per-unit reduction and volume demand. Results of Spheron Fan-In WLCSP Technology Qualification and 200 mm to 300 mm Scale Up at Nanium, using FlipChipInternational Technology Licensing