SIW components for the Internet of Things: Novel topologies, materials, and manufacturing techniques

This paper presents an overview of the recent achievements in the development of novel components and manufacturing technologies for the next generation of wireless components and systems, suitable for the Internet of Things (IoT). The technological requirements of the IoT are discussed in this paper: they include, among others, the need for compact and low-cost wireless systems, the adoption of effective integration solutions, the use of eco-friendly materials and fabrication technologies, and the development of wearable devices. The microwave components presented in this work are based on the substrate integrated waveguide (SIW) technology, which looks to be a suitable candidate for the development of a large variety of microwave components and antennas, as well as for the integration of entire systems. Compact solutions based on folded SIW and quarter-mode SIW structures are presented, and the use of novel materials (like paper and textile) and fabrication technologies (like 3D printing and additive manufacturing) are discussed.