论文信息 - Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits.

[1] E. Rajo-Iglesias,et al. Local Metamaterial-Based Waveguides in Gaps Between Parallel Metal Plates , 2009, IEEE Antennas and Wireless Propagation Letters.

[2] D. Dawn,et al. A novel electromagnetic bandgap metal plate for parallel plate mode suppression in shielded structures , 2002, IEEE Microwave and Wireless Components Letters.

[3] Jorge R. Costa,et al. Electromagnetic Characterization of Textured Surfaces Formed by Metallic Pins , 2008, IEEE Transactions on Antennas and Propagation.

[4] A. Kishk,et al. EM Modeling of surfaces with STOP or GO characteristics-artificial magnetic conductors and soft and , 2003 .

[5] Per-Simon Kildal,et al. Artificially soft and hard surfaces in electromagnetics , 1990 .