Research on heat dissipation of RF microsystem 3D packaging based on gold stud bumps and Au-Sn eutectic welding
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[1] M. Kawano. Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration , 2021, 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
[2] K. Chiang,et al. Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging , 2021, Micromachines.
[3] J. Lau. Semiconductor Advanced Packaging , 2021 .
[4] K. Tu,et al. Interconnect Quality and Reliability of 3D Packaging , 2020, 3D Microelectronic Packaging.
[5] Philippe Auxemery,et al. Packaged High Power Frond-End Module for Broadband 24GHz & 28GHz 5G solutions , 2018, 2018 IEEE 5G World Forum (5GWF).
[6] Jun Zhou,et al. 3D heterogeneous integration technology using hot via MMIC and silicon interposer with millimeter wave application , 2017, 2017 IEEE MTT-S International Microwave Symposium (IMS).
[7] Anthony E. Parker,et al. Soldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging , 2016, 2016 IEEE MTT-S International Microwave Symposium (IMS).
[8] F. Bertoluzza,et al. Three-dimensional finite-element thermal simulation of GaN-based HEMTs , 2009, Microelectron. Reliab..
[9] C. Karnfelt,et al. 60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects , 2007, IEEE Microwave and Wireless Components Letters.